RF PIN Attenuator diode, surface mount, featuring a 6-pin TSSOP package with gull-wing leads. This component offers a maximum reverse voltage of 50V and a maximum forward current of 100mA. Key electrical specifications include a maximum forward voltage of 1.1V at 50mA and a maximum series resistance of 1.9 Ohms at 100mA, down to 100 Ohms at 0.5mA. Maximum diode capacitance is 0.25pF at 20V, with a typical carrier life time of 1.25 us. Operating temperature range is -65°C to 150°C.
PackageTSSOP
MountingSurface Mount
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Technical Specifications
NXP BAP70AM/A2,115 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
6
PCB
6
Package Length (mm)
2.2(Max)
Package Width (mm)
1.35(Max)
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Type
Attenuator
Configuration
Double Dual Series
Maximum Reverse Voltage
50V
Maximum Forward Current
100mA
Maximum Forward Voltage
1.1@50mAV
Maximum Series Resistance @ Maximum IF
1.9@100mAOhm
Maximum Series Resistance @ Minimum IF
Maximum Diode Capacitance
0.25@20VpF
Typical Carrier Life Time
1.25us
Maximum Power Dissipation
300mW
Min Operating Temperature
-65°C
Max Operating Temperature
150°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BAP70AM/A2,115 Datasheet
Download the complete datasheet for NXP BAP70AM/A2,115 to view detailed technical specifications.
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