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Technical Specifications
NXP BB148,115 technical specifications.
General
Capacitance
36.8pF
Contact Plating
Tin
Diode Capacitance-Max
41.8pF
Forward Current
20mA
Height
1.05mm
Lead Free
Lead Free
Length
1.8mm
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Max Repetitive Reverse Voltage (Vrrm)
30V
Mount
Surface Mount
Package Quantity
1
Packaging
Tape and Reel
Radiation Hardening
No
Reach SVHC Compliant
No
Reverse Voltage (DC)
30V
RoHS Compliant
Yes
Width
1.35mm
Compliance
RoHS
Compliant
Datasheet
NXP BB148,115 Datasheet
Download the complete datasheet for NXP BB148,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.