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Technical Specifications
NXP BB156,135 technical specifications.
General
Capacitance
14.4pF
Contact Plating
Tin
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Mount
Surface Mount
Package Quantity
10000
Packaging
Tape and Reel
Reverse Voltage
10V
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
NXP BB156,135 Datasheet
Download the complete datasheet for NXP BB156,135 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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