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Technical Specifications
NXP BB182/L,315 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOD |
| Package/Case | SOD-523 |
| Package Description | Small Outline Diode Package |
| Lead Shape | Flat |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 1.25(Max) |
| Package Width (mm) | 0.85(Max) |
| Package Height (mm) | 0.65(Max) |
| Seated Plane Height (mm) | 0.65(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | SOD-523 |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8541100070 |
| Schedule B | 8541100070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP BB182/L,315 Datasheet
Download the complete datasheet for NXP BB182/L,315 to view detailed technical specifications.
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