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Technical Specifications
NXP BB182/L,315 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOD
Package/Case
SOD-523
Package Description
Small Outline Diode Package
Lead Shape
Flat
Pin Count
2
PCB
2
Package Length (mm)
1.25(Max)
Package Width (mm)
0.85(Max)
Package Height (mm)
0.65(Max)
Seated Plane Height (mm)
0.65(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
SOD-523
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8541100070
Schedule B
8541100070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BB182/L,315 Datasheet
Download the complete datasheet for NXP BB182/L,315 to view detailed technical specifications.
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