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Technical Specifications
NXP BB189115 technical specifications.
General
| Capacitance | 2.05pF |
| Package/Case | SC |
| Contact Plating | Tin |
| Forward Current | 20mA |
| Lead Free | Lead Free |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| Reverse Voltage (DC) | 32V |
| Termination | SMD/SMT |
Compliance
| RoHS | Compliant |
Datasheet
NXP BB189115 Datasheet
Download the complete datasheet for NXP BB189115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.