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NXP BB208-03,135 technical specifications.
| Capacitance | 19.9pF |
| Contact Plating | Tin |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Package Quantity | 10000 |
| Packaging | Tape and Reel |
| Reverse Voltage | 10V |
| RoHS Compliant | Yes |
| RoHS | Compliant |
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