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Technical Specifications
NXP BFG425W/C,115 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | CMPAK |
| Package/Case | CMPAK |
| Package Description | Compact Mini Package |
| Lead Shape | Gull-wing |
| Pin Count | 4 |
| PCB | 3 |
| Tab | Tab |
| Package Length (mm) | 2.2(Max) |
| Package Width (mm) | 1.35(Max) |
| Package Height (mm) | 1(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 1.3 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | NPN |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP BFG425W/C,115 Datasheet
Download the complete datasheet for NXP BFG425W/C,115 to view detailed technical specifications.
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