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Technical Specifications
NXP BGA2022/C,115 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
6
PCB
6
Package Length (mm)
2.2(Max)
Package Width (mm)
1.35(Max)
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BGA2022/C,115 Datasheet
Download the complete datasheet for NXP BGA2022/C,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.