Frequency2.2GHz
PackageTSSOP
Current10.5mA
MountingSurface Mount
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Technical Specifications
NXP BGA2800,115 technical specifications.
General
Package/Case
TSSOP
Contact Plating
Tin
Gain
20.2dB
Lead Free
Lead Free
Max Frequency
2.2GHz
Max Power Dissipation
200mW
Max Supply Voltage
3.6V
Min Supply Voltage
3V
Mount
Surface Mount
Noise Figure
3.7dB
Number of Channels
6
Operating Supply Current
55mA
Operating Supply Voltage
3.3V
P1dB
-2dBm
Package Quantity
1
Packaging
Tape and Reel
Power Dissipation
200mW
Radiation Hardening
No
RoHS Compliant
Yes
Supply Current
10.5mA
Test Frequency
2.15GHz
Compliance
RoHS
Compliant
Datasheet
NXP BGA2800,115 Datasheet
Download the complete datasheet for NXP BGA2800,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.