Sign in to ask questions about the NXP BGA2801,115 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
NXP BGA2801,115 technical specifications.
| Package/Case | TSSOP |
| Contact Plating | Tin |
| Gain | 23dB |
| Lead Free | Lead Free |
| Max Frequency | 2.2GHz |
| Max Power Dissipation | 200mW |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 3V |
| Mount | Surface Mount |
| Noise Figure | 3.9dB |
| Number of Channels | 6 |
| Operating Frequency | 250 MHz to 2150 MHz |
| Operating Supply Current | 55mA |
| Operating Supply Voltage | 3.3V |
| P1dB | 0dBm |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 200mW |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 14.3mA |
| Termination | SMD/SMT |
| Test Frequency | 2.15GHz |
| RoHS | Compliant |
Download the complete datasheet for NXP BGA2801,115 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
