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Technical Specifications
NXP BGA2802,115 technical specifications.
General
| Package/Case | TSSOP |
| Contact Plating | Tin |
| Gain | 31dB |
| Lead Free | Lead Free |
| Max Frequency | 2.2GHz |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 200mW |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 3V |
| Mount | Surface Mount |
| Noise Figure | 4.1dB |
| Number of Channels | 1 |
| Operating Frequency | 0 Hz to 2.2 GHz |
| Operating Supply Current | 12.5mA |
| Operating Supply Voltage | 3.3V |
| P1dB | 7dBm |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Power Dissipation | 200mW |
| Radiation Hardening | No |
| Supply Current | 12.5mA |
| Test Frequency | 2.15GHz |
Compliance
| RoHS | Compliant |
Datasheet
NXP BGA2802,115 Datasheet
Download the complete datasheet for NXP BGA2802,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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