Single RF amplifier IC operating up to 3GHz, featuring 23dB gain and a 3.4dB noise figure. This surface-mount device supports I2C and SPI interfaces, with a 3.3V maximum supply voltage and 2.7V minimum. It includes 128B RAM, 3.5KB FLASH memory, and 11 programmable I/O pins, all within a 6-pin TSSOP package.
Frequency3GHz
PackageTSSOP
Current5.8mA
MountingSurface Mount
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Technical Specifications
NXP BGA2803,115 technical specifications.
General
Package/Case
TSSOP
Core Architecture
PIC
Data Bus Width
8b
Gain
23dB
Interface
I2C, SPI
Max Frequency
3GHz
Max Operating Temperature
125°C
Max Power Dissipation
200mW
Max Supply Voltage
3.3V
Memory Size
3.5KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Min Supply Voltage
2.7V
Mount
Surface Mount
Noise Figure
3.4dB
Number of Channels
1
Number of Programmable I/O
11
Number of Timers/Counters
3
Operating Frequency
0 Hz to 2.2 GHz
Operating Supply Current
5.8mA
Operating Supply Voltage
3V
P1dB
-8dBm
Package Quantity
1
Packaging
Tape and Reel
Power Dissipation
200mW
Radiation Hardening
No
RAM Size
128B
RoHS Compliant
Yes
Supply Current
5.8mA
Test Frequency
2.15GHz
Watchdog Timer
Yes
Compliance
RoHS
Compliant
Datasheet
NXP BGA2803,115 Datasheet
Download the complete datasheet for NXP BGA2803,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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