Single RF amplifier IC operating up to 3GHz, featuring 23dB gain and a 3.4dB noise figure. This surface-mount device supports I2C and SPI interfaces, with a 3.3V maximum supply voltage and 2.7V minimum. It includes 128B RAM, 3.5KB FLASH memory, and 11 programmable I/O pins, all within a 6-pin TSSOP package.
Frequency3GHz
PackageTSSOP
Current5.8mA
MountingSurface Mount
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Technical Specifications
NXP BGA2803,115 technical specifications.
General
| Package/Case | TSSOP |
| Core Architecture | PIC |
| Data Bus Width | 8b |
| Gain | 23dB |
| Interface | I2C, SPI |
| Max Frequency | 3GHz |
| Max Operating Temperature | 125°C |
| Max Power Dissipation | 200mW |
| Max Supply Voltage | 3.3V |
| Memory Size | 3.5KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Min Supply Voltage | 2.7V |
| Mount | Surface Mount |
| Noise Figure | 3.4dB |
| Number of Channels | 1 |
| Number of Programmable I/O | 11 |
| Number of Timers/Counters | 3 |
| Operating Frequency | 0 Hz to 2.2 GHz |
| Operating Supply Current | 5.8mA |
| Operating Supply Voltage | 3V |
| P1dB | -8dBm |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 200mW |
| Radiation Hardening | No |
| RAM Size | 128B |
| RoHS Compliant | Yes |
| Supply Current | 5.8mA |
| Test Frequency | 2.15GHz |
| Watchdog Timer | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP BGA2803,115 Datasheet
Download the complete datasheet for NXP BGA2803,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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