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Technical Specifications
NXP BGA2815,115 technical specifications.
General
| Package/Case | TSSOP |
| Contact Plating | Tin |
| Gain | 25.2dB |
| Lead Free | Lead Free |
| Max Frequency | 2.2GHz |
| Max Power Dissipation | 200mW |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 3V |
| Mount | Surface Mount |
| Noise Figure | 3.7dB |
| Number of Channels | 6 |
| Operating Frequency | 250 MHz to 2150 MHz |
| Operating Supply Current | 55mA |
| Operating Supply Voltage | 3.3V |
| P1dB | 1dBm |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 200mW |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 18.2mA |
| Termination | SMD/SMT |
| Test Frequency | 2.15GHz |
Compliance
| RoHS | Compliant |
Datasheet
NXP BGA2815,115 Datasheet
Download the complete datasheet for NXP BGA2815,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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