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NXP BGA2866,115 technical specifications.
| Package/Case | TSSOP |
| Contact Plating | Tin |
| Gain | 24.3dB |
| Lead Free | Lead Free |
| Max Frequency | 2.2GHz |
| Max Power Dissipation | 200mW |
| Max Supply Voltage | 5.5V |
| Min Supply Voltage | 4.5V |
| Mount | Surface Mount |
| Noise Figure | 3.9dB |
| Number of Channels | 6 |
| Operating Supply Current | 17.4mA |
| Operating Supply Voltage | 5V |
| P1dB | 3dBm |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 200mW |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 17.4mA |
| Test Frequency | 2.15GHz |
| RoHS | Compliant |
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