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Technical Specifications
NXP BGA2867,115 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 6 |
| PCB | 6 |
| Package Length (mm) | 2.2(Max) |
| Package Width (mm) | 1.35(Max) |
| Package Height (mm) | 1(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Manufacturer Type | Wideband Amplifier |
| Number of Channels per Chip | 1 |
| Minimum Operating Frequency | 2800MHz |
| Typical Output Power Range | 4 to 10dBm |
| Maximum Operating Frequency | 3200MHz |
| Typical 3dB Bandwidth | 3000MHz |
| Typical Power Gain | 26.4@2150MHzdB |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP BGA2867,115 Datasheet
Download the complete datasheet for NXP BGA2867,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.