The NXP BGA2869 is a surface-mount, lead-frame SMT RF amplifier with a 6-pin TSSOP package. It has a maximum operating frequency of 2200 MHz and a typical 3dB bandwidth of 3000 MHz. The amplifier's typical power gain is 32.2 dB at 2150 MHz, and its maximum operating temperature is 125 degrees Celsius. The BGA2869 is suitable for use in RF applications where high gain and frequency stability are required.
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NXP BGA2869 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 6 |
| PCB | 6 |
| Package Length (mm) | 2.2(Max) |
| Package Width (mm) | 1.35(Max) |
| Package Height (mm) | 1(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Manufacturer Type | MMIC Amplifier |
| Number of Channels per Chip | 1 |
| Minimum Operating Frequency | 0MHz |
| Typical Output Power Range | 4 to 10dBm |
| Maximum Operating Frequency | 2200MHz |
| Typical 3dB Bandwidth | 3000MHz |
| Typical Power Gain | 32.2@2150MHzdB |
| Max Operating Temperature | 125°C |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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