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NXP BGA2870,115 technical specifications.
| Package/Case | TSSOP |
| Contact Plating | Tin |
| Gain | 31dB |
| Max Frequency | 750MHz |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 200mW |
| Max Supply Voltage | 2.7V |
| Min Supply Voltage | 2.3V |
| Mount | Surface Mount |
| Noise Figure | 3.7dB |
| Number of Channels | 1 |
| Operating Frequency | 0 Hz to 750 MHz |
| Operating Supply Current | 16mA |
| Operating Supply Voltage | 2.5V |
| P1dB | 4dBm |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 200mW |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 16mA |
| Test Frequency | 2.15GHz |
| RoHS | Compliant |
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