Quick Jump:
Technical Specifications
NXP BGA7124 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | SON |
| Package/Case | HVSON EP |
| Package Description | Heat Sinked Very Thin Small Outline No Lead, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 3.1(Max) |
| Package Width (mm) | 3.1(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-229 |
| Manufacturer Type | MMIC Amplifier |
| Number of Channels per Chip | 1 |
| Typical Output Power Range | 20 to 30dBm |
| Maximum Operating Frequency | 2700MHz |
| Typical Power Gain | 14.2@2445MHzdB |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP BGA7124 Datasheet
Download the complete datasheet for NXP BGA7124 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.