The BGA7124,118 is a surface mount, non-lead-frame MMIC amplifier with a typical output power range of 20 to 30 milliwatts and a maximum operating frequency of 2700 MHz. It is packaged in a heat sinked very thin small outline no lead, exposed pad (HVSON EP) package with 8 pins and a maximum seated plane height of 1 millimeter. The amplifier is designed for surface mount applications and has a maximum operating temperature of 150 degrees Celsius.
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NXP BGA7124,118 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | SON |
| Package/Case | HVSON EP |
| Package Description | Heat Sinked Very Thin Small Outline No Lead, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 3.1(Max) |
| Package Width (mm) | 3.1(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-229 |
| Manufacturer Type | MMIC Amplifier |
| Number of Channels per Chip | 1 |
| Typical Output Power Range | 20 to 30dBm |
| Maximum Operating Frequency | 2700MHz |
| Typical Power Gain | 14.2@2445MHzdB |
| Max Operating Temperature | 150°C |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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