PackageHVSON EP
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP BGA7124,118 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
SON
Package/Case
HVSON EP
Package Description
Heat Sinked Very Thin Small Outline No Lead, Exposed Pad
Lead Shape
No Lead
Pin Count
8
PCB
8
Package Length (mm)
3.1(Max)
Package Width (mm)
3.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-229
Manufacturer Type
MMIC Amplifier
Number of Channels per Chip
1
Typical Output Power Range
20 to 30dBm
Maximum Operating Frequency
2700MHz
Typical Power Gain
14.2@2445MHzdB
Max Operating Temperature
150°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BGA7124,118 Datasheet
Download the complete datasheet for NXP BGA7124,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.