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Technical Specifications
NXP BGB100,112 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package/Case
QMAN
Lead Shape
No Lead
Pin Count
22
PCB
22
Package Length (mm)
12.55(Max)
Package Width (mm)
10.1(Max)
Package Height (mm)
1.9(Max)
Mounting
Surface Mount
Compliance
Cage Code
H1R01
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP BGB100,112 Datasheet
Download the complete datasheet for NXP BGB100,112 to view detailed technical specifications.
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