Sign in to ask questions about the NXP BGB100,112 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
NXP BGB100,112 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package/Case | QMAN |
| Lead Shape | No Lead |
| Pin Count | 22 |
| PCB | 22 |
| Package Length (mm) | 12.55(Max) |
| Package Width (mm) | 10.1(Max) |
| Package Height (mm) | 1.9(Max) |
| Mounting | Surface Mount |
| Cage Code | H1R01 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for NXP BGB100,112 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
