PackageSOT-363
MountingSurface Mount
Power200mW
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Technical Specifications
NXP BGM1013,115 technical specifications.
General
Package/Case
SOT-363
Contact Plating
Tin
Gain
35.5dB
Lead Free
Lead Free
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Power Dissipation
200mW
Max Supply Voltage
5.5V
Min Supply Voltage
4.5V
Mount
Surface Mount
Noise Figure
4.7dB
Number of Channels
1
Operating Supply Current
27.5mA
Operating Supply Voltage
5V
P1dB
13dBm
Package Quantity
1
Packaging
Tape and Reel
Power Dissipation
200mW
Radiation Hardening
No
RoHS Compliant
Yes
Test Frequency
1GHz
Weight
0.000212oz
Compliance
RoHS
Compliant
Datasheet
NXP BGM1013,115 Datasheet
Download the complete datasheet for NXP BGM1013,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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