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Technical Specifications
NXP BGM1013,115 technical specifications.
General
| Package/Case | SOT-363 |
| Contact Plating | Tin |
| Gain | 35.5dB |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 200mW |
| Max Supply Voltage | 5.5V |
| Min Supply Voltage | 4.5V |
| Mount | Surface Mount |
| Noise Figure | 4.7dB |
| Number of Channels | 1 |
| Operating Supply Current | 27.5mA |
| Operating Supply Voltage | 5V |
| P1dB | 13dBm |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 200mW |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Test Frequency | 1GHz |
| Weight | 0.000212oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP BGM1013,115 Datasheet
Download the complete datasheet for NXP BGM1013,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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