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Technical Specifications
NXP BGU8009,115 technical specifications.
General
| Contact Plating | Tin |
| Frequency | 1.61GHz |
| Gain | 18dB |
| Lead Free | Lead Free |
| Max Frequency | 1.61GHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 55mW |
| Max Supply Voltage | 3.1V |
| Min Supply Voltage | 1.5V |
| Mount | Surface Mount |
| Noise Figure | 0.65dB |
| Operating Supply Current | 4.4mA |
| Operating Supply Voltage | 1.8V |
| P1dB | -7dBm |
| Package Quantity | 5000 |
| Packaging | Cut Tape |
| RoHS Compliant | Yes |
| Supply Current | 10mA |
| Test Frequency | 1.61GHz |
Compliance
| RoHS | Compliant |
Datasheet
NXP BGU8009,115 Datasheet
Download the complete datasheet for NXP BGU8009,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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