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Technical Specifications
NXP BUK1M200-50SGTD,11 technical specifications.
General
| Package/Case | SO |
| Continuous Drain Current (ID) | 2.7A |
| Drain to Source Breakdown Voltage | 50V |
| Drain to Source Resistance | 380mR |
| Fall Time | 1600ns |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Output Current | 6.1A |
| Mount | Surface Mount |
| Number of Outputs | 4 |
| On-State Resistance | 150mR |
| Output Current per Channel | 2.7A |
| Package Quantity | 500 |
| Packaging | Tape and Reel |
| Polarity | N-CHANNEL |
| Power Dissipation | 9.4W |
| RoHS Compliant | Yes |
| Series | TOPFET™ |
| Turn-Off Delay Time | 3200ns |
Compliance
| RoHS | Compliant |
Datasheet
NXP BUK1M200-50SGTD,11 Datasheet
Download the complete datasheet for NXP BUK1M200-50SGTD,11 to view detailed technical specifications.
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