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Technical Specifications
NXP BUK9230-55A,118 technical specifications.
General
| Package/Case | SOT |
| Contact Plating | Tin, Matte |
| Continuous Drain Current (ID) | 38A |
| Drain to Source Breakdown Voltage | 55V |
| Drain to Source Resistance | 27mR |
| Drain to Source Voltage (Vdss) | 55V |
| Fall Time | 68ns |
| Gate to Source Voltage (Vgs) | 10V |
| Input Capacitance | 1.725nF |
| Max Dual Supply Voltage | 55V |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 88W |
| Package Quantity | 2500 |
| Packaging | Tape and Reel |
| Polarity | N-CHANNEL |
| Power Dissipation | 88W |
| Rds On Max | 27mR |
| RoHS Compliant | Yes |
| Series | TrenchMOS™ |
| Turn-Off Delay Time | 64ns |
| Turn-On Delay Time | 14ns |
Compliance
| RoHS | Compliant |
Datasheet
NXP BUK9230-55A,118 Datasheet
Download the complete datasheet for NXP BUK9230-55A,118 to view detailed technical specifications.
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