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NXP BZV55-B56,115 technical specifications.
| Lead Free | Lead Free |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Packaging | Cut Tape |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | 50nA @ 39.2V |
| Zener Voltage | 56V |
| RoHS | Compliant |
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