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Technical Specifications
NXP BZV55-C3V9 technical specifications.
General
| Current | 250mA |
| Diameter | 1.6mm |
| Height | 3.7mm |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Max Reverse Leakage Current | 3uA |
| Mount | Surface Mount |
| Packaging | Cut Tape |
| Power Dissipation | 500mW |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
| Tolerance | 5% |
| Zener Voltage | 3.9V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZV55-C3V9 Datasheet
Download the complete datasheet for NXP BZV55-C3V9 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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