PackageDO-35
MountingThrough Hole
Power500mW
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Technical Specifications
NXP BZX79-C16,133 technical specifications.
General
Package/Case
DO-35
Contact Plating
Tin
Element Configuration
Single
ESD Protection
No
Impedance
40R
Lead Free
Lead Free
Max Operating Temperature
200°C
Min Operating Temperature
-65°C
Max Power Dissipation
400mW
Max Reverse Leakage Current
50nA
Mount
Through Hole
Package Quantity
10000
Packaging
Tape and Reel
Power Dissipation
500mW
Radiation Hardening
No
RoHS Compliant
Yes
Tolerance
5%
Voltage Tolerance
5%
Zener Voltage
16.2V
Compliance
RoHS
Compliant
Datasheet
NXP BZX79-C16,133 Datasheet
Download the complete datasheet for NXP BZX79-C16,133 to view detailed technical specifications.
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