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Technical Specifications
NXP CX24109 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
36
PCB
36
Package Length (mm)
6
Package Width (mm)
6
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220
Compliance
Cage Code
H1R01
HTS Code
8542390001
Schedule B
8542390000
ECCN
5A991.b.1
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP CX24109 Datasheet
Download the complete datasheet for NXP CX24109 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.