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Technical Specifications
NXP DSPB56725CAF technical specifications.
General
| Package/Case | LQFP |
| Core Architecture | RISC |
| Data Bus Width | 24b |
| Frequency | 200MHz |
| Halogen Free | Halogen Free |
| Interface | I2C, SPI |
| Lead Free | Lead Free |
| Max Frequency | 200MHz |
| Max I/O Voltage | 3.3V |
| Max Operating Temperature | 85°C |
| Memory Type | SDRAM, |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Operating Supply Voltage | 4V |
| Package Quantity | 90 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 112KB |
| RoHS Compliant | Yes |
| Series | DSP56K/Symphony |
| Weight | 0.022489oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP DSPB56725CAF Datasheet
Download the complete datasheet for NXP DSPB56725CAF to view detailed technical specifications.
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