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Technical Specifications
NXP DSPB56725CAF technical specifications.
General
Package/Case
LQFP
Core Architecture
RISC
Data Bus Width
24b
Frequency
200MHz
Halogen Free
Halogen Free
Interface
I2C, SPI
Lead Free
Lead Free
Max Frequency
200MHz
Max I/O Voltage
3.3V
Max Operating Temperature
85°C
Memory Type
SDRAM,
Min Operating Temperature
-40°C
Mount
Surface Mount
Operating Supply Voltage
4V
Package Quantity
90
Packaging
Tray
Radiation Hardening
No
RAM Size
112KB
RoHS Compliant
Yes
Series
DSP56K/Symphony
Weight
0.022489oz
Compliance
RoHS
Compliant
Datasheet
NXP DSPB56725CAF Datasheet
Download the complete datasheet for NXP DSPB56725CAF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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