PackageQFN
MountingSurface Mount
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Technical Specifications
NXP FXOS8700CQ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN
Package Description
Quad Flat No Lead Package
Lead Shape
No Lead
Pin Count
16
PCB
16
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
1.2(Max)
Seated Plane Height (mm)
1.25(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Category
Accelerometer and Magnetometer
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP FXOS8700CQ Datasheet
Download the complete datasheet for NXP FXOS8700CQ to view detailed technical specifications.
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