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Technical Specifications
NXP HTRC12002B/07D technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BBA
Category
Co-Processor
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP HTRC12002B/07D Datasheet
Download the complete datasheet for NXP HTRC12002B/07D to view detailed technical specifications.
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