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Technical Specifications
NXP KMI16/1/C,115 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
SIP
Package/Case
SIP
Package Description
Single In Line Package
Lead Shape
Through Hole
Pin Count
3
PCB
3
Package Length (mm)
5.7(Max)
Package Width (mm)
2.6(Max)
Package Height (mm)
13.25(Max)
Seated Plane Height (mm)
14.3(Max)
Pin Pitch (mm)
2.35(Max)
Package Material
Plastic
Mounting
Through Hole
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8541500080
Schedule B
8541500080
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP KMI16/1/C,115 Datasheet
Download the complete datasheet for NXP KMI16/1/C,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.