The LH75401N0Q100C0,55 is a 144-pin LQFP lead-frame SMT microcontroller from NXP. It features a low profile quad flat package with a maximum package length and width of 20.1mm and a maximum package height of 1.45mm. The device has a seated plane height of 1.6mm and a pin pitch of 0.5mm. It is designed for surface mount applications and is made of plastic. The package type is MS-026BFB per Jedec.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the NXP LH75401N0Q100C0,55 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 144 |
| PCB | 144 |
| Package Length (mm) | 20.1(Max) |
| Package Width (mm) | 20.1(Max) |
| Package Height (mm) | 1.45(Max) |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BFB |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP LH75401N0Q100C0,55 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
