Frequency50MHz
PackageTSSOP
MountingSurface Mount
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Technical Specifications
NXP LPC1112FDH28/102:5 technical specifications.
General
Package/Case
TSSOP
Core Architecture
ARM
Data Bus Width
32b
Frequency
50MHz
Interface
I2C, SPI, UART, USART
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Size
16KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Min Supply Voltage
1.8V
Mount
Surface Mount
Number of Timers/Counters
4
Operating Supply Voltage
3.3V
Package Quantity
2500
Packaging
Tape and Reel
RAM Size
4KB
Compliance
RoHS
Compliant
Datasheet
NXP LPC1112FDH28/102:5 Datasheet
Download the complete datasheet for NXP LPC1112FDH28/102:5 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.