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Technical Specifications
NXP LPC1113FHN33/302K technical specifications.
General
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Interface | I2C, SPI, UART, USART |
| Max Frequency | 50MHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 1.5W |
| Memory Size | 24KB |
| Memory Type | FLASH, |
| Number of Programmable I/O | 28 |
| Number of Timers/Counters | 4 |
| Operating Supply Voltage | 3.3V |
| Package Quantity | 1300 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 8KB |
| RoHS Compliant | Yes |
| Watchdog Timer | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP LPC1113FHN33/302K Datasheet
Download the complete datasheet for NXP LPC1113FHN33/302K to view detailed technical specifications.
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