Frequency50MHz
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Technical Specifications
NXP LPC1113FHN33/302K technical specifications.
General
Core Architecture
ARM
Data Bus Width
32b
Interface
I2C, SPI, UART, USART
Max Frequency
50MHz
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Power Dissipation
1.5W
Memory Size
24KB
Memory Type
FLASH,
Number of Programmable I/O
28
Number of Timers/Counters
4
Operating Supply Voltage
3.3V
Package Quantity
1300
Packaging
Tray
Radiation Hardening
No
RAM Size
8KB
RoHS Compliant
Yes
Watchdog Timer
Yes
Compliance
RoHS
Compliant
Datasheet
NXP LPC1113FHN33/302K Datasheet
Download the complete datasheet for NXP LPC1113FHN33/302K to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.