Frequency72MHz
PackageVQFN
MountingSurface Mount
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Technical Specifications
NXP LPC1311FHN33/01,55 technical specifications.
General
Package/Case
VQFN
Core Architecture
ARM
Data Bus Width
32b
Frequency
72MHz
Interface
I2C, SPI, UART, USART
Max Operating Temperature
85°C
Max Supply Voltage
3.6V
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Min Supply Voltage
2V
Mount
Surface Mount
Number of I/Os
28
Number of Timers/Counters
4
Operating Supply Voltage
3.3V
Oscillator Type
Internal
Package Quantity
260
Packaging
Tray
Peripherals
Brown-out Detect/Reset, POR, WDT
RAM Size
4KB
RoHS Compliant
Yes
Series
LPC13xx
Compliance
RoHS
Compliant
Datasheet
NXP LPC1311FHN33/01,55 Datasheet
Download the complete datasheet for NXP LPC1311FHN33/01,55 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.