The LPC1857FET180,551 is a surface mount microcontroller packaged in a 180-pin Thin Fine Pitch Ball Grid Array (TFBGA). It features a plastic package with a seated plane height of 1.06mm and a pin pitch of 0.8mm. The device is designed for surface mount applications and is suitable for use in a variety of electronic systems. The LPC1857FET180,551 is manufactured by NXP and is a member of the microcontroller family.
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NXP LPC1857FET180,551 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 180 |
| PCB | 180 |
| Package Length (mm) | 12 |
| Package Width (mm) | 12 |
| Package Height (mm) | 0.71 |
| Seated Plane Height (mm) | 1.06 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP LPC1857FET180,551 to view detailed technical specifications.
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