64-pin LQFP microcontroller featuring a 16/32-bit ARM7TDMI-S RISC core operating up to 60 MHz. This surface-mount device offers 256KB of Flash program memory and 16KB of RAM. It includes 46 programmable I/Os, two timers, and supports I2C and SPI interfaces. The plastic, low-profile quad flat package has a 0.5mm pin pitch and dimensions of 10.1mm x 10.1mm x 1.4mm. Operating voltage ranges from 1.8V to 3.3V with an extended temperature range of -40°C to 85°C.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP LPC2124FBD64/01 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
64
PCB
64
Package Length (mm)
10.1(Max)
Package Width (mm)
10.1(Max)
Package Height (mm)
1.4(Max)
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BCD
Family Name
LPC2000
Data Bus Width
16|32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
60MHz
Maximum CPU Frequency
60MHz
Device Core
ARM7TDMI-S
Program Memory Type
Flash
Program Memory Size
256KB
RAM Size
16KB
Number of Programmable I/Os
46
Core Architecture
ARM
Programmability
Yes
Number of Timers
2
Interface Type
I2C/SPI
CAN
0
I2C
1
SPI
2
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
1.95|3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
4
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP LPC2124FBD64/01 Datasheet
Download the complete datasheet for NXP LPC2124FBD64/01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.