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Technical Specifications
NXP LPC2124FBD64,151 technical specifications.
General
Package/Case
LQFP
Core Architecture
ARM
Interface
I2C, SPI, SSP, UART, USART
Max Operating Temperature
85°C
Memory Size
256KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
46
Oscillator Type
Internal
Package Quantity
160
Packaging
Tray
Peripherals
POR, PWM, WDT
RoHS Compliant
Yes
Series
LPC2100
Compliance
RoHS
Compliant
Datasheet
NXP LPC2124FBD64,151 Datasheet
Download the complete datasheet for NXP LPC2124FBD64,151 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.