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Technical Specifications
NXP LPC2212FBD144,551 technical specifications.
General
Package/Case
LQFP
Core Architecture
ARM
Density
128KB
Frequency
60MHz
Interface
I2C, SPI, SSP, UART, USART, EBI/EMI
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
1.95V
Memory Size
128KB
Memory Type
FLASH,
Min Supply Voltage
1.65V
Number of I/Os
112
Number of PWM Channels
6
Number of Timers/Counters
4
Oscillator Type
Internal
Package Quantity
60
Packaging
Tray
Peripherals
POR, PWM, WDT
RAM Size
16KB
Reach SVHC Compliant
No
RoHS Compliant
Yes
Series
LPC2200
Compliance
RoHS
Compliant
Datasheet
NXP LPC2212FBD144,551 Datasheet
Download the complete datasheet for NXP LPC2212FBD144,551 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.