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Technical Specifications
NXP LPC2292FET144,551 technical specifications.
General
Package/Case
TFBGA
Core Architecture
ARM
Interface
I2C, SPI, CAN, SSP, UART, USART, EBI/EMI
Max Frequency
60MHz
Max Operating Temperature
85°C
Max Power Dissipation
1.5W
Memory Size
256KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
112
Number of Programmable I/O
112
Number of Timers/Counters
2
Oscillator Type
Internal
Package Quantity
189
Packaging
Tray
Peripherals
POR, PWM, WDT
Radiation Hardening
No
RAM Size
16KB
RoHS Compliant
No
Series
LPC2200
Watchdog Timer
Yes
Compliance
RoHS
Not CompliantNo
Datasheet
NXP LPC2292FET144,551 Datasheet
Download the complete datasheet for NXP LPC2292FET144,551 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.