Frequency180MHz
PackageTFBGA
MountingSurface Mount
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Technical Specifications
NXP LPC3152FET208551 technical specifications.
General
Package/Case
TFBGA
Core Architecture
ARM
Data Bus Width
32b
Frequency
180MHz
Interface
I2C, SPI, USB, IrDA, MMC, UART, USART, EBI/EMI, I2S
Max Frequency
180MHz
Max Operating Temperature
85°C
Max Supply Voltage
3.3V
Memory Type
ROMless,
Min Operating Temperature
-40°C
Min Supply Voltage
1.8V
Mount
Surface Mount
Number of I/Os
10
Number of Timers/Counters
5
Oscillator Type
External
Package Quantity
189
Packaging
Tray
Peripherals
PWM, WDT, DMA, LCD
RAM Size
192KB
Reach SVHC Compliant
No
Series
LPC3100
Compliance
RoHS
Compliant
Datasheet
NXP LPC3152FET208551 Datasheet
Download the complete datasheet for NXP LPC3152FET208551 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.