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NXP LPC4337FET100,551 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 100 |
| PCB | 100 |
| Package Length (mm) | 9.1(Max) |
| Package Width (mm) | 9.1(Max) |
| Package Height (mm) | 0.8(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | ARM Cortex M4/M0 |
| Program Memory Type | Flash |
| Number of Programmable I/Os | 49 |
| Number of Timers | 6 |
| Interface Type | CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB |
| ADC Channels | 4/4 |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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