PackageQFN EP
Current5mA
MountingSurface Mount
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Technical Specifications
NXP MC10XS3412DHFKR2 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN EP
Package Description
Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
24
PCB
24
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
2.15(Max)
Seated Plane Height (mm)
2.2(Max)
Package Material
Plastic
Mounting
Surface Mount
Type
High Side
Minimum Output Current
6(Max)A
Switch On Resistance
0.044Ohm
Supply Current
5mA
Interface Type
Serial
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Operating Supply Voltage Range
3 to 5.5V
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC10XS3412DHFKR2 Datasheet
Download the complete datasheet for NXP MC10XS3412DHFKR2 to view detailed technical specifications.
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