PackagePower QFN EP
Current10mA
MountingSurface Mount
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Technical Specifications
NXP MC10XS3535HFKR2 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
Power QFN EP
Lead Shape
No Lead
Pin Count
24
PCB
24
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
2.2(Max)
Seated Plane Height (mm)
2.2(Max)
Package Material
Plastic
Mounting
Surface Mount
Type
High Side
Number of Outputs
5
Minimum Output Current
0.14A
Switch On Resistance
0.055(Max)Ohm
Maximum Input Voltage
6 to 28V
Supply Current
10mA
Interface Type
Serial
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Operating Supply Voltage Range
6 to 28V
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC10XS3535HFKR2 Datasheet
Download the complete datasheet for NXP MC10XS3535HFKR2 to view detailed technical specifications.
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