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Technical Specifications
NXP MC13136DWR2 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC W
Package Description
Small Outline IC Wide Body
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
15.54(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.36(Max)
Seated Plane Height (mm)
2.65(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AD
Category
Receiver
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Modulation Technique
FM
Maximum RF Operating Frequency Range
100 to 500MHz
Maximum RF Operating Frequency
200MHz
Min Operating Supply Voltage
2V
Max Operating Supply Voltage
6V
Typical Operating Supply Voltage
2.5V|3.3V|5V
Compliance
Cage Code
H1R01
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC13136DWR2 Datasheet
Download the complete datasheet for NXP MC13136DWR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.