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Technical Specifications
NXP MC13136DWR2 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC W |
| Package Description | Small Outline IC Wide Body |
| Lead Shape | Gull-wing |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 15.54(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.36(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AD |
| Category | Receiver |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Modulation Technique | FM |
| Maximum RF Operating Frequency Range | 100 to 500MHz |
| Maximum RF Operating Frequency | 200MHz |
| Min Operating Supply Voltage | 2V |
| Max Operating Supply Voltage | 6V |
| Typical Operating Supply Voltage | 2.5V|3.3V|5V |
Compliance
| Cage Code | H1R01 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP MC13136DWR2 Datasheet
Download the complete datasheet for NXP MC13136DWR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.