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Technical Specifications
NXP MC13892DJVKR2 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
139
PCB
139
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
0.92
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Function
Application Processors
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC13892DJVKR2 Datasheet
Download the complete datasheet for NXP MC13892DJVKR2 to view detailed technical specifications.
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