
The MC145480DW is a 20-pin surface mount CODEC with a lead-frame SMT package in a SOIC W configuration. It has a maximum package length of 12.95mm, width of 7.6mm, and height of 2.4mm. The device is made of plastic and weighs 0.5195g. It is designed for surface mount applications and meets the Jedec MS-013AC standard.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the NXP MC145480DW datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
NXP MC145480DW technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC W |
| Package Description | Small Outline IC Wide Body |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 12.95(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.4(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Weight (g) | 0.5195 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AC |
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for NXP MC145480DW to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.