Frequency16MHz
PackageLQFP
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Technical Specifications
NXP MC16Z3BCAG16 technical specifications.
General
| Package/Case | LQFP |
| Data Bus Width | 16b |
| Interface | SPI, SCI, EBI/EMI |
| Max Frequency | 16MHz |
| Max Operating Temperature | 85°C |
| Memory Size | 8KB |
| Memory Type | ROM, , Mask ROM |
| Min Operating Temperature | -40°C |
| Number of I/Os | 16 |
| Number of Programmable I/O | 16 |
| Number of Timers/Counters | 8 |
| Oscillator Type | External |
| Package Quantity | 60 |
| Packaging | Tray |
| Peripherals | POR, PWM, WDT |
| RAM Size | 4KB |
| Series | HC16 |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC16Z3BCAG16 Datasheet
Download the complete datasheet for NXP MC16Z3BCAG16 to view detailed technical specifications.
No datasheet is available for this part.