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Technical Specifications
NXP MC33199DR2 technical specifications.
General
| Package/Case | SOIC |
| Lead Free | Contains Lead |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Output Current | 4mA |
| Packaging | Cut Tape |
| RoHS Compliant | No |
Compliance
| RoHS | Not Compliant |
Datasheet
NXP MC33199DR2 Datasheet
Download the complete datasheet for NXP MC33199DR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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